KRX:000660

SK hynix Inc. reported record-breaking financial results for the first quarter of 2026, driven by strong demand for AI-related memory products.

Revenue reached 52.6 trillion won, marking the first time quarterly sales exceeded 50 trillion won, while operating profit surged to 37.6 trillion won with a record 72% margin. Net profit also rose sharply to 40.3 trillion won, reflecting significantly improved profitability.

The performance was fueled by robust demand for high-value products such as HBM, high-capacity DRAM modules, and enterprise SSDs, as global investment in AI infrastructure continues to accelerate. The company also strengthened its financial position, achieving a net cash balance of around 35 trillion won.

Looking ahead, SK hynix expects continued growth in memory demand as AI evolves toward real-time, “agentic” applications. The company plans to expand production capacity and invest in advanced technologies, including next-generation DRAM and NAND solutions, to maintain its competitive edge.
SK hynix announced the mass production of its 192GB SOCAMM2 memory module, positioning it as a next-generation standard for AI server performance.

The SOCAMM2 module is based on LPDDR5X DRAM built on the advanced 1cnm process and is specifically designed for AI server environments, including NVIDIA’s Vera Rubin platform. It adapts low-power mobile memory technology for high-performance data center use, combining compact form factor with scalability.

The company highlighted that the new module delivers more than double the bandwidth and over 75% better power efficiency compared to conventional RDIMM solutions, addressing critical energy and performance constraints in AI infrastructure.

SK hynix expects SOCAMM2 to significantly reduce memory bottlenecks in large language model (LLM) training and inference, particularly for models with hundreds of billions of parameters. As AI workloads increasingly shift toward training, the demand for high-capacity, energy-efficient memory solutions is rising.

With early stabilization of mass production and close collaboration with global cloud and AI partners, including NVIDIA, SK hynix aims to strengthen its position as a leading provider of AI-focused memory solutions.
SK Group Chairman Chey Tae-won met Broadcom CEO Hock Tan on February 6 in San Jose to discuss deepening cooperation in AI memory and next-generation chip development.

Amid growing volatility in global memory supply and demand driven by AI expansion, the two companies reviewed their collaboration on high bandwidth memory (HBM) for data centers and explored strategies to stabilize semiconductor supply across the AI infrastructure ecosystem. SK hynix highlighted its mass-production experience and quality competitiveness in HBM to support Broadcom’s key global projects.

The discussions also focused on next-generation AI chip architectures and memory integration. With Broadcom developing customized AI accelerators and networking solutions and SK hynix advancing HBM performance, both sides examined new design and packaging approaches to optimize AI chips and memory simultaneously.

SK hynix shared its future HBM roadmap and agreed with Broadcom to expand early-stage integration of memory technology into AI chip design, reinforcing a “one-team” strategy in the global AI market.
SK hynix reported record-breaking financial results for fiscal year 2025, driven by strong AI memory demand and the rapid expansion of high value-added products such as HBM.

The company posted FY2025 revenue of KRW 97.15 trillion, operating profit of KRW 47.21 trillion, and net profit of KRW 42.95 trillion, marking the highest annual performance in its history. Revenue rose by more than KRW 30 trillion year on year, while operating profit nearly doubled, supported by a sharp improvement in margins to 49%.

Momentum accelerated in the fourth quarter, with revenue rising 34% quarter on quarter to KRW 32.83 trillion and operating profit surging 68% to KRW 19.17 trillion. Operating margin reached 58%, reflecting strong pricing and product mix, particularly in HBM and server memory.

HBM revenue more than doubled year on year, while SK hynix strengthened its leadership in advanced DRAM with mass production of the 1cnm process and the launch of high-capacity 256GB DDR5 server modules. In NAND, the company completed development of 321-layer QLC products and achieved record annual revenue, supported by strong eSSD demand in the second half.

Looking ahead, SK hynix expects sustained growth as AI workloads expand from training to inference, increasing demand not only for HBM but also for server DRAM and NAND. The company plans to maintain leadership in HBM4, expand custom HBM offerings, and scale production capacity through new fabs and advanced packaging facilities in Korea and the US.

Reflecting its strong cash generation, SK hynix announced enhanced shareholder returns, including an additional KRW 1 trillion dividend and the cancellation of 15.3 million treasury shares. Management emphasized a continued focus on balancing long-term investment, financial stability, and shareholder value while positioning the company as a core infrastructure partner in the AI era.
SK hynix announced plans to establish a new U.S.-based AI solutions firm as part of its strategy to strengthen its position in the rapidly expanding AI data center ecosystem.

The new entity, tentatively named AI Company (AI Co.), will serve as the hub for SK Group’s AI initiatives and aims to become a key partner for global AI data center customers. Leveraging SK hynix’s leadership in advanced memory technologies such as high-bandwidth memory (HBM), AI Co. is expected to deliver optimized AI systems and comprehensive AI data center solutions.

AI Co. will be created through the restructuring of Solidigm, SK hynix’s California-based enterprise SSD subsidiary. Solidigm will retain its brand by transferring its existing operations to a newly formed entity, Solidigm Inc., while AI Co. will focus exclusively on AI-driven business opportunities. The final corporate name of AI Co. is expected to be announced later in 2026.

SK hynix plans to commit USD 10 billion to AI Co., with capital deployed on a phased, capital-call basis. Through this platform, the company is also considering investments in and partnerships with innovative U.S.-based AI firms to create synergies across SK Group affiliates.

The move underscores SK hynix’s ambition to capitalize on the accelerating global AI race, where demand for high-end memory is increasingly seen as critical to overcoming performance bottlenecks in AI infrastructure. The company stated that it intends to work closely with global partners while proactively creating long-term value for customers in the emerging AI era.
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