The Investor
16 Feb 2026, 15:27
SK Group Chairman Chey Tae-won met Broadcom CEO Hock Tan on February 6 in San Jose to discuss deepening cooperation in AI memory and next-generation chip development.
Amid growing volatility in global memory supply and demand driven by AI expansion, the two companies reviewed their collaboration on high bandwidth memory (HBM) for data centers and explored strategies to stabilize semiconductor supply across the AI infrastructure ecosystem. SK hynix highlighted its mass-production experience and quality competitiveness in HBM to support Broadcom’s key global projects.
The discussions also focused on next-generation AI chip architectures and memory integration. With Broadcom developing customized AI accelerators and networking solutions and SK hynix advancing HBM performance, both sides examined new design and packaging approaches to optimize AI chips and memory simultaneously.
SK hynix shared its future HBM roadmap and agreed with Broadcom to expand early-stage integration of memory technology into AI chip design, reinforcing a “one-team” strategy in the global AI market.
Amid growing volatility in global memory supply and demand driven by AI expansion, the two companies reviewed their collaboration on high bandwidth memory (HBM) for data centers and explored strategies to stabilize semiconductor supply across the AI infrastructure ecosystem. SK hynix highlighted its mass-production experience and quality competitiveness in HBM to support Broadcom’s key global projects.
The discussions also focused on next-generation AI chip architectures and memory integration. With Broadcom developing customized AI accelerators and networking solutions and SK hynix advancing HBM performance, both sides examined new design and packaging approaches to optimize AI chips and memory simultaneously.
SK hynix shared its future HBM roadmap and agreed with Broadcom to expand early-stage integration of memory technology into AI chip design, reinforcing a “one-team” strategy in the global AI market.