TDK CORP TSE:6762 Price, Chart, News & Insight

TDK Corporation announced that its board has approved a proposal to increase its year-end dividend for FY ending March 2026 to 20 yen per share, subject to shareholder approval at the June 19, 2026 meeting.

The proposed dividend is higher than the previously forecast 18 yen and up from 16 yen in the prior year. This brings the total annual dividend to 36 yen per share, including an interim dividend of 16 yen, compared to 30 yen in the previous fiscal year.

The total dividend payout amounts to approximately 37.96 billion yen, with an effective payment date of June 22, 2026. The payout ratio stands at around 34.9%, in line with the company’s policy of targeting a 35% dividend payout ratio while supporting long-term earnings growth and shareholder value.

Source: TDK Corporation

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European Investor 04-28-26

Tokyo, April 15, 2026 — TDK Corporation has introduced a new series of high-voltage common-mode chokes designed to enable more compact and efficient DC converter systems operating at up to 1250V.

The newly launched B82722V6*B040 series targets next-generation applications such as power converters, industrial motor drives, and switch-mode power supplies, particularly those using advanced SiC and GaN semiconductors. The components are engineered to suppress electromagnetic interference (EMI) while maintaining high performance in systems with elevated DC bus voltages.

Featuring a compact design and high resonance frequency, the chokes allow engineers to reduce printed circuit board (PCB) space without compromising electrical isolation or reliability. The series supports inductance values ranging from 3.3 mH to 22 mH and rated currents up to 3.0 A, with robust insulation tested up to 3,750V.

TDK stated that the product complies with key international safety standards and is suitable for modern high-voltage architectures, helping manufacturers meet increasing demands for efficiency, miniaturization, and performance in power electronics.

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Global Finance News 04-15-26

TDK Corporation announced the launch of its new ultra-small noise suppression filters (MAF0603GWY series), designed for smartphones, wearables, and other compact consumer devices.

The new components deliver industry-leading noise attenuation above 5 GHz while minimizing audio distortion through a newly developed low-distortion ferrite material. This innovation addresses a key limitation of conventional chip beads, which often degrade sound quality.

Measuring just 0.6 mm, the filters also feature lower electrical resistance, enabling reduced signal loss and a wider dynamic range. Mass production is scheduled to begin in April 2026.

The product targets applications in high-frequency communication technologies, including 5G, Wi-Fi, Bluetooth, and emerging next-generation standards.

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The Investor 04-07-26

TDK Corporation and Nippon Chemical Industrial announced the establishment of a joint venture to develop materials and manufacturing processes for electronic components.

The partnership will focus on advanced materials such as ceramics used in multilayer ceramic capacitors (MLCCs), combining the companies’ technological expertise to accelerate research and development.

The joint venture aims to shorten the time from prototyping to commercialization and improve responsiveness to customer needs by integrating development and evaluation capabilities.

The move follows a basic agreement signed in November 2025 and represents a strategic effort to strengthen innovation in key electronic component materials.

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Global Finance News 04-04-26

TDK Corporation announced it will begin manufacturing advanced sensors for Apple products in the United States, marking a significant expansion of their long-standing partnership.

The initiative, part of Apple’s American Manufacturing Program, represents the first time a Japanese company will produce components for Apple within the U.S. It aims to strengthen supply chain resilience and enhance sensor production capabilities through closer Japan–U.S. collaboration.

TDK has worked with Apple for over 30 years on next-generation sensors, electronic components, and batteries. The new U.S.-based production is expected to support Apple’s efforts to increase domestic manufacturing while improving reliability and scalability of critical components.

Both companies highlighted the move as a strategic step to deepen collaboration and accelerate advanced manufacturing capabilities in the United States.

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Global Finance News 03-27-26

TDK launches high-efficiency ORing modules for industrial and communications applications

TDK Corporation announced the release of its TDK-Lambda i1R series ORing FET modules, designed to enhance power supply redundancy and efficiency across industrial and communications systems.

The new modules support 60A and 80A operation with input voltages up to 60Vdc, replacing traditional diode-based ORing solutions with MOSFET-based technology. This enables higher efficiency of up to 99.5%, while reducing power losses and heat generation.

The i1R series features a fast 500 ns turn-off response to block reverse current during fault conditions, improving system protection. Its compact 1 x 1-inch form factor and low on-resistance simplify thermal management and save board space, while requiring no external components.

Target applications include communications infrastructure, test and measurement equipment, and harsh industrial environments such as robotics, where durability against shock and vibration is critical.

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The Investor 03-18-26

TDK Corporation introduced the MT40 series ThermoFuse varistors, compact surge protection components capable of handling peak surge currents up to 50 kA.

The new devices combine a compact form factor with integrated thermal disconnect technology and patented overmolding, enhancing safety and reliability in high-voltage environments. The MT40 series supports AC voltages from 150 V to 550 V and DC voltages from 200 V to 750 V, with a short-circuit current rating of up to 200 kA.

These components are designed for applications including photovoltaic systems, industrial power supplies, outdoor lighting, telecommunications equipment and surge protection devices. Additional features such as a micro-switch for remote monitoring and optional visual indicators improve system integration and operational safety.

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European Investor 03-05-26

TDK Corporation (TSE: 6762) has announced the establishment of its Asia-Pacific Regional Headquarters (APAC RHQ) in Bengaluru, India, effective April 1, 2026.

The new entity, TDK Asia-Pacific Pvt. Ltd., will operate alongside TDK Singapore Pte. Ltd. under a dual-city structure spanning Bengaluru and Singapore. The APAC RHQ will oversee more than 20 TDK entities across India, Southeast Asia, and Oceania, representing nearly 17% of TDK’s global workforce.

The move forms part of TDK’s long-term “TDK Transformation” strategy, aiming to strengthen regional governance, supply chain resilience, market intelligence, and R&D capabilities. India will serve as a growth and technology hub, leveraging its engineering talent and innovation ecosystem, while Singapore will anchor governance, compliance, and supply chain coordination across the region.

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European Investor 03-03-26

TDK Corporation has launched two new aluminum electrolytic capacitor series designed for DC link applications in on-board chargers (OBCs) for electric vehicles, targeting higher-voltage and higher-current next-generation platforms.

The newly introduced B43655 and B43656 series are optimized for forced cooling operation and compact installation, addressing efficiency and reliability requirements in space-constrained OBC designs. The B43655 series features voltage ratings of 475 V and 500 V, capacitance values from 110 µF to 880 µF, and supports 800 V battery architectures. It offers ripple current capability up to 3.29 A at +105°C and ESR values down to 100 mΩ, with a useful life exceeding 3,000 hours at +105°C.

The B43656 series, rated at 450 V, supports even higher ripple currents of up to 4.42 A at +105°C, making it suitable for demanding high-power OBC topologies.

Both series are AEC-Q200 Rev. E qualified, RoHS-compliant, and available in compact snap-in designs with diameters from 22 mm to 35 mm and lengths from 25 mm to 60 mm. The capacitors will also be integrated into TDK’s web-based AlCap Useful Life Calculation Tool, providing design engineers with enhanced lifecycle modeling support.

With these additions, TDK strengthens its portfolio of automotive-grade passive components aimed at supporting the shift toward 800 V e-mobility architectures and higher power density OBC systems.

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The Investor 02-19-26

TDK Launches Automotive NTC Thermistors Rated Up to +175 °C

TDK Corporation announced the expansion of its NTCSP series with high-reliability automotive NTC thermistors capable of operating at temperatures up to +175 °C. Mass production began in February 2026.

The new components address rising temperature demands in automotive power modules, where more heat-resistant power semiconductors require equally robust supporting components. Previously rated up to +150 °C, TDK’s updated series now supports a wider operating range of -55 °C to +175 °C.

The thermistors are AEC-Q200 compliant and designed for conductive-glue mounting using AgPd (silver-palladium) terminals, enabling stable performance at elevated temperatures where traditional solder mounting may be insufficient. They are suited for temperature detection and compensation in automotive systems such as anti-lock braking systems (ABS), transmissions, and engines.

The NTCSP series is available in 10 kΩ and 100 kΩ variants in a compact 1.6 × 0.8 mm package. TDK stated it will continue expanding chip sizes, characteristics, and temperature ranges to meet evolving automotive and industrial requirements.

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WS Investor 02-17-26

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