Global Finance News
15 Apr 2026, 13:05
Tokyo, April 15, 2026 — TDK Corporation has introduced a new series of high-voltage common-mode chokes designed to enable more compact and efficient DC converter systems operating at up to 1250V.
The newly launched B82722V6*B040 series targets next-generation applications such as power converters, industrial motor drives, and switch-mode power supplies, particularly those using advanced SiC and GaN semiconductors. The components are engineered to suppress electromagnetic interference (EMI) while maintaining high performance in systems with elevated DC bus voltages.
Featuring a compact design and high resonance frequency, the chokes allow engineers to reduce printed circuit board (PCB) space without compromising electrical isolation or reliability. The series supports inductance values ranging from 3.3 mH to 22 mH and rated currents up to 3.0 A, with robust insulation tested up to 3,750V.
TDK stated that the product complies with key international safety standards and is suitable for modern high-voltage architectures, helping manufacturers meet increasing demands for efficiency, miniaturization, and performance in power electronics.
The newly launched B82722V6*B040 series targets next-generation applications such as power converters, industrial motor drives, and switch-mode power supplies, particularly those using advanced SiC and GaN semiconductors. The components are engineered to suppress electromagnetic interference (EMI) while maintaining high performance in systems with elevated DC bus voltages.
Featuring a compact design and high resonance frequency, the chokes allow engineers to reduce printed circuit board (PCB) space without compromising electrical isolation or reliability. The series supports inductance values ranging from 3.3 mH to 22 mH and rated currents up to 3.0 A, with robust insulation tested up to 3,750V.
TDK stated that the product complies with key international safety standards and is suitable for modern high-voltage architectures, helping manufacturers meet increasing demands for efficiency, miniaturization, and performance in power electronics.