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#NASDAQ:MRVL

Marvell Technology announced that board members Michael Strachan and Robert Switz will not seek reelection at the company’s Annual Meeting of Stockholders on June 13, 2025. Both have served since 2016 and played key roles during Marvell’s transformation. Strachan has been Lead Independent Director and Audit Committee Chair, while Switz led the Executive Compensation Committee. Brad Buss, a director since 2018, will become Lead Independent Director following the meeting. The remaining board members, including CEO Matt Murphy, are nominated for reelection. Marvell emphasized the contributions of both departing directors and its strong position in data infrastructure and AI.
Marvell achieves successful interoperability of Structera CXL portfolio with AMD EPYC and Intel Xeon platforms

Marvell Technology announced that its Structera portfolio of Compute Express Link (CXL) devices has demonstrated interoperability with AMD EPYC processors and 5th Gen Intel Xeon Scalable platforms. This development supports the adoption of CXL 2.0 solutions in next-generation cloud data centers, addressing memory bandwidth and capacity demands.

Key highlights:

- Interoperability testing with AMD and Intel across various workloads and configurations validated stability, scalability, and performance.
- Structera supports memory expansion and workload acceleration for cloud service providers and OEMs.
- Enables deployment across diverse hardware configurations using both AMD and Intel architectures.

Product details:

- Structera A includes near-memory accelerators with Arm Neoverse V2 cores, DDR5 support, and up to 1.6 Tbps bandwidth for workloads like deep learning recommendation models.
- Structera X offers memory expansion using DDR4 and DDR5 DIMMs, focused on cost and energy efficiency.

Executive commentary:

Will Chu of Marvell stated that the collaboration with AMD and Intel supports a scalable infrastructure and reduces complexity. Raghu Nambiar of AMD emphasized combining EPYC processors with Marvell’s CXL solutions to improve memory efficiency and flexibility. Richelle Ahlvers of Intel confirmed support for CXL 2.0 to optimize memory deployment across data centers.
Marvell to Sell Automotive Ethernet Business to Infineon for $2.5 Billion in Cash

Marvell Technology announced that it has entered into a definitive agreement to sell its Automotive Ethernet business to Infineon Technologies AG for $2.5 billion in an all-cash transaction. The sale includes Marvell’s Brightlane® Automotive Ethernet portfolio and is expected to close later in 2025, pending regulatory approvals.

The business currently generates between $225–250 million in annual revenue and represents a key divestiture as Marvell sharpens its focus on core data infrastructure solutions. CEO Matt Murphy stated the deal delivers strong financial returns and positions the business for continued success under Infineon's automotive-optimized platform. Marvell will provide more details during its Q1 fiscal 2026 earnings call on May 29, 2025.
Marvell Technology, Inc. (NASDAQ: MRVL) today announced it will conduct a conference call following the release of its first quarter of fiscal year 2026 financial results on Thursday, May 29, 2025, at 1:45 p.m. Pacific Time.
Marvell Showcases Next-Gen Copper Connectivity with AEC DSPs at OFC 2025

Marvell Technology has unveiled new demonstrations of its Alaska® A 800G and 1.6T PAM4 DSPs for Active Electrical Cables (AECs) at OFC 2025. Developed in partnership with major cable manufacturers like 3M, Amphenol, Broadex, Luxshare-Tech, and TE Connectivity, these technologies support rapidly increasing bandwidth needs driven by AI and cloud computing.

The Alaska A 1.6T DSP, designed for 200G/lane infrastructures, enables high-performance copper interconnects up to three meters inside data center racks. Meanwhile, the 800G DSP supports 100G/lane connections for up to seven meters—more than triple the reach of passive copper cables at that bandwidth.

AECs, combining copper cabling with DSPs originally used in optical modules, are ideal for short-reach, high-bandwidth applications in AI server environments. Marvell’s innovation is set to help hyperscalers scale up efficiently while ensuring signal integrity and power efficiency.

The Alaska A 1.6T DSP is now generally available, with demonstrations taking place at partner booths throughout OFC 2025. Marvell projects strong growth in the AEC silicon market, expected to reach $1.3 billion by 2029.
Marvell Highlights Next-Gen Interconnect Technologies for AI at OFC 2025

Marvell Technology showcased its latest interconnect innovations for AI-driven infrastructure at OFC 2025 in San Francisco. The company emphasized technologies designed to support scale-up and scale-out networks, with a focus on higher bandwidth, energy efficiency, and extended reach to meet the needs of next-generation AI and cloud data centers.

As AI infrastructure becomes more complex, Marvell is introducing solutions to support rack- and row-scale systems, including co-packaged optics (CPO), linear pluggable optics (LPO), active electrical cables (AEC), and PCIe retimer technologies. These advancements are expected to help handle larger data volumes, reduce latency, and support more powerful AI training and inference.

Key technologies on display included:
- 400G PAM4 electrical-to-optical links operating at 224 Gbaud.
- New co-packaged and near-packaged platforms for dense interconnect needs.
- A 1.6T silicon photonics light engine operating at 200G per lane.
- Ara, a 3nm 1.6T PAM4 platform for high-bandwidth optical interconnects.
- COLORZ 800, an 800G pluggable optics module enabling long-distance AI data transfers.
- Alaska A AEC DSPs delivering 1.6T bandwidth across 200G lanes.
- PCIe Gen 6 and Gen 7 retimer technologies demonstrated over optics.
- A 51.2T scale-out fabric model simulating real-time AI cluster traffic.

Executives also participated in panels and technical sessions, underscoring Marvell’s leadership in shaping AI connectivity. The company’s roadmap shows its commitment to collaborating with industry partners to support the future of data infrastructure.
Marvell Unveils 1.6T Silicon Photonics Light Engine for AI Networks at OFC 2025

Marvell Technology has introduced its 1.6T silicon photonics light engine at OFC 2025, aimed at transforming rack-scale AI interconnects. The new device, part of Marvell’s light engine portfolio, is designed for low-power, high-bandwidth applications using linear-drive pluggable optics (LPO) and on-board optics. It supports eight channels of 200 Gbps PAM4 optical signaling, enabling a total throughput of 1.6 terabits per second.

The light engine integrates key components including linear drivers, transimpedance amplifiers, a silicon photonics chip, and an embedded microcontroller, all within a single compact package. It consumes less than 5 picojoules per bit under typical conditions and is optimized for use in LPO modules, retimed optics, and as a foundation for co-packaged optics (CPO) systems.

The technology offers a power-efficient alternative to passive copper for rack-scale and row-scale connectivity in AI systems. Its modular design helps speed up system integration and time to market for hyperscalers and optical module vendors.

Currently sampling to select customers, the 1.6T light engine positions Marvell to lead the transition from copper to optical connectivity in future data center infrastructure.
Marvell Unveils Breakthrough 400G/Lane PAM4 Technology at OFC 2025

Marvell Technology has introduced the industry’s first 400G/lane PAM4 electrical-to-optical link, marking a major milestone in data infrastructure innovation. The demonstration, showcased at OFC 2025 in San Francisco, features a complete link operating at 224 Gbaud using real silicon, representing a fourfold increase in bandwidth over today’s common 100G/lane systems and double that of the 200G/lane technology being deployed this year.

The breakthrough is the result of collaboration with optical and switch leaders including Lumentum, TeraHop, and Coherent. Demonstrations at the event include key components such as PAM4 DSPs, transimpedance amplifiers, and photonics technologies tailored for serial 400G/lane speeds.

This advancement aims to dramatically boost bandwidth and efficiency in cloud data centers and AI infrastructures, supporting faster data processing and shorter AI training times. With pluggable transceiver modules expected to dominate optical connectivity through 2030, Marvell and its partners are laying the groundwork for scalable, high-speed networks.

Marvell’s long-standing leadership in PAM4 technology is now extending into the 400G era, offering a future-ready solution for evolving connectivity demands in data-driven industries.
**Marvell and TeraHop Unveil First End-to-End PCIe Gen 6 Over Optics at OFC 2025**

On March 27, 2025, Marvell Technology, Inc. announced a breakthrough collaboration with optical solutions provider TeraHop, showcasing the industry’s first end-to-end PCIe Gen 6 over optics at OFC 2025 in Santa Clara, California. The demonstration highlights a successful transmission of PCIe Gen 6 signals across a 10-meter optical link, using Marvell’s Alaska P PCIe Gen 6 retimer integrated into a TeraHop-designed riser card and active optical cable.

The solution offers low-latency, low bit-error-rate transmission while extending PCIe's traditional electrical reach. It is designed to support scale-up infrastructure in AI-driven data centers, enabling high-speed optical connectivity between AI accelerators, CPUs, SSDs, NICs, and memory using PCIe or CXL protocols.

Additionally, Marvell and TeraHop previewed PCIe Gen 7 SerDes running at 128 GT/s over optical modules, pointing to future standard-based, high-performance, low-latency interconnects. Marvell emphasized its commitment to advancing interconnect technologies essential for the growing demands of AI infrastructure.

Marvell Vice President Xi Wang noted this development as a milestone for scalable AI systems, while TeraHop's VP Rang-Chen Yu emphasized the role of optical innovation in hyperscale data centers.

For more, visit www.marvell.com.
Marvell Showcases Industry’s First End-to-End PCIe Gen 6 Over Optics at OFC 2025

Santa Clara, CA – Marvell Technology, Inc. and TeraHop have announced a joint demonstration of the industry's first end-to-end PCIe Gen 6 over optics solution at OFC 2025. The demonstration showcases low-latency transmission over a 10-meter optical link using Marvell’s Alaska P PCIe Gen 6 retimer, enabling scalable, high-performance infrastructure for AI data centers.

This solution addresses the growing bandwidth and distance needs of AI-driven workloads by converting electrical PCIe signals into optical data. The demo includes PCIe Gen 6 signals traveling between the root complex and endpoint via TeraHop’s OSFP-XD active optical cable, using a custom retimed riser card. It ensures fast, reliable connections among CPUs, AI accelerators, CXL memory, SSDs, and NICs.

Additionally, Marvell and TeraHop demonstrated PCIe Gen 7 SerDes operating at 128 GT/s over linear-drive pluggable optics, highlighting future-ready performance for hyperscale environments.

TeraHop VP of Marketing Rang-Chen Yu emphasized the value of the partnership in accelerating adoption of high-speed connectivity. Xi Wang, VP and GM of Marvell’s Connectivity Business Unit, noted that the demonstration affirms Marvell’s leadership in enabling low-latency AI infrastructure through PCIe innovation and PAM technologies.

The solution is designed to support hyperscaler demands for performance, efficiency, and scalability in the next generation of accelerated data centers.

For more details, visit [www.marvell.com](https://www.marvell.com).

Marvell Technology Files Prospectus Supplement
March 12, 2025 – Marvell Technology, Inc. (Nasdaq: MRVL) announced the filing of a prospectus supplement to its automatic shelf registration statement on Form S-3 with the SEC.

The filing is related to the issuance and sale of securities as outlined in the supplement.
Legal opinion from Wilson Sonsini Goodrich & Rosati regarding the validity of the securities issuance is attached as Exhibit 5.1.
Marvell Technology Reports Strong Fiscal 2025 Q4 and Full-Year Results

Santa Clara, Calif. – March 5, 2025 – Marvell Technology, Inc. (NASDAQ: MRVL) has announced its financial results for the fourth quarter and fiscal year ending February 1, 2025, with record quarterly revenue of $1.817 billion, reflecting a 27% year-over-year increase. The company also reported significant growth in the data center segment and strong cash flow performance.

Key Financial Highlights
Fourth Quarter Fiscal 2025

Net revenue: $1.817 billion, up 27% year-over-year
GAAP gross margin: 50.5%; non-GAAP gross margin: 60.1%
GAAP diluted income per share: $0.23; non-GAAP diluted income per share: $0.60
Cash flow from operations: $514.0 million
Full Year Fiscal 2025

Net revenue: $5.767 billion
GAAP net loss: $(885.0) million, or $(1.02) per diluted share
Non-GAAP net income: $1.377 billion, or $1.57 per diluted share
Operating cash flow: $1.68 billion
Matt Murphy, Chairman and CEO of Marvell, highlighted the company’s strong performance, noting record revenue growth driven by a 78% year-over-year increase in data center revenue. Marvell also secured multiple design wins for custom AI silicon programs and interconnect products, positioning the company for further expansion in fiscal 2026.

Fiscal 2026 Q1 Outlook
Expected net revenue: $1.875 billion +/- 5%
GAAP gross margin: ~50.5%; non-GAAP gross margin: ~60%
GAAP operating expenses: ~$712 million; non-GAAP operating expenses: ~$490 million
GAAP diluted net income per share: $0.19 +/- $0.05
Non-GAAP diluted net income per share: $0.61 +/- $0.05
Growth in Data Infrastructure Markets
Marvell’s revenue growth was fueled by a surge in demand for its data center solutions, which accounted for 75% of total revenue in Q4. Other end markets, including enterprise networking and carrier infrastructure, saw mixed performance.

Revenue by End Market (Q4 Fiscal 2025 vs. Q4 Fiscal 2024)

Data center: $1.37 billion (+78%)
Enterprise networking: $171.4 million (-35%)
Carrier infrastructure: $105.8 million (-38%)
Consumer: $88.7 million (-38%)
Automotive/industrial: $85.7 million (+4%)
Strategic Investments and Future Outlook
Marvell continues to expand its AI and cloud data center offerings. With volume production of custom AI silicon programs underway and strong demand for interconnect solutions, the company expects over 60% year-over-year revenue growth in Q1 fiscal 2026.

Conference Call and Webcast
Marvell will host a conference call on March 5, 2025, at 1:45 p.m. Pacific Time to discuss the results. A live webcast will be available on the Marvell Investor Relations website, with a replay accessible until March 12, 2025.

Forward-Looking Statements
This report contains forward-looking statements subject to risks and uncertainties, including demand fluctuations, geopolitical conditions, and evolving industry trends. Investors are advised to review Marvell’s SEC filings for a comprehensive risk assessment.

About Marvell
Marvell Technology develops semiconductor solutions for data infrastructure, enabling enterprises, cloud providers, and communications networks to manage, store, and process data efficiently. Trusted by leading technology companies, Marvell continues to innovate in AI, 5G, and cloud computing.
Marvell Technology has demonstrated its first 2nm silicon IP, built on TSMC’s 2nm process, for next-generation AI and cloud infrastructure. The new platform is designed to enhance hyperscalers’ performance and efficiency, supporting the development of custom AI accelerators, CPUs, and networking solutions. The technology includes high-speed 3D I/O for vertically stacking die inside chiplets, a key innovation to increase bandwidth and reduce connections.

This 2nm platform continues Marvell’s leadership in advanced semiconductor manufacturing, following its 5nm platform in 2020 and 3nm platform in 2022. The company’s approach integrates high-speed SerDes, die-to-die interconnects, custom high-bandwidth memory, and compute fabrics like PCIe Gen 7 to build custom AI and cloud solutions.

Marvell's collaboration with TSMC is critical to developing high-performance, power-efficient silicon solutions for AI infrastructure. TSMC's senior vice president Kevin Zhang emphasized their joint effort in utilizing advanced silicon and packaging technologies to push the boundaries of AI processing capabilities.

(Source: Marvell Technology)

Marvell Technology, Inc. has announced it will host an Investor Day in New York City on Tuesday, June 10, 2025. The event will feature presentations from Chairman and CEO Matt Murphy, along with the senior leadership team. Further details, including webcast access information, will be shared closer to the event. Attendance is by invitation only.

Marvell, a leader in data infrastructure semiconductor solutions, focuses on enabling enterprise, cloud, automotive, and carrier architectures through its innovative semiconductor technologies. For over 25 years, the company has collaborated closely with leading technology firms to move, store, process, and secure global data.

For more details, investors can contact Senior Vice President of Investor Relations, Ashish Saran, at ir@marvell.com.