Marvell Highlights Next-Gen Interconnect Technologies for AI at OFC 2025

Marvell Technology showcased its latest interconnect innovations for AI-driven infrastructure at OFC 2025 in San Francisco. The company emphasized technologies designed to support scale-up and scale-out networks, with a focus on higher bandwidth, energy efficiency, and extended reach to meet the needs of next-generation AI and cloud data centers.

As AI infrastructure becomes more complex, Marvell is introducing solutions to support rack- and row-scale systems, including co-packaged optics (CPO), linear pluggable optics (LPO), active electrical cables (AEC), and PCIe retimer technologies. These advancements are expected to help handle larger data volumes, reduce latency, and support more powerful AI training and inference.

Key technologies on display included:
- 400G PAM4 electrical-to-optical links operating at 224 Gbaud.
- New co-packaged and near-packaged platforms for dense interconnect needs.
- A 1.6T silicon photonics light engine operating at 200G per lane.
- Ara, a 3nm 1.6T PAM4 platform for high-bandwidth optical interconnects.
- COLORZ 800, an 800G pluggable optics module enabling long-distance AI data transfers.
- Alaska A AEC DSPs delivering 1.6T bandwidth across 200G lanes.
- PCIe Gen 6 and Gen 7 retimer technologies demonstrated over optics.
- A 51.2T scale-out fabric model simulating real-time AI cluster traffic.

Executives also participated in panels and technical sessions, underscoring Marvell’s leadership in shaping AI connectivity. The company’s roadmap shows its commitment to collaborating with industry partners to support the future of data infrastructure.