At the Intel Foundry Direct Connect 2025 event, Intel outlined major developments in its foundry strategy, showcasing advances in process technology, packaging capabilities, manufacturing, and ecosystem partnerships.

Intel confirmed that its Intel 18A node is in risk production, with volume manufacturing expected in 2025. Two new variants—Intel 18A-P and 18A-PT—will provide enhanced performance, with 18A-PT supporting advanced 3D stacking via Foveros Direct. Intel also introduced the 14A process node, with early PDKs distributed and customer engagement underway. On the packaging front, Intel launched new technologies including EMIB-T and two new Foveros variants (R and B), enabling more flexible multi-die designs. The company highlighted a successful “run the lot” milestone at Fab 52 in Arizona and confirmed U.S.-based development and production for Intel 18A and 14A.

Intel also expanded its Foundry Accelerator Alliance with the launch of the Intel Foundry Chiplet Alliance and new ecosystem collaborations with Synopsys, Cadence, Siemens EDA, and PDF Solutions. These moves aim to support design co-optimization, streamline advanced chip development, and broaden adoption of Intel Foundry services.

Synopsys announced a major collaboration with Intel Foundry to advance angstrom-scale chip design using Intel's 18A and 18A-P process technologies.

Synopsys has developed production-ready digital and analog design flows and the broadest IP portfolio for these advanced nodes, including support for RibbonFET and PowerVia technologies. The partnership also includes optimized tools for Intel’s new EMIB-T advanced packaging, enabling high-density, multi-die chip design.

Synopsys is also contributing to Intel's upcoming 14A-E node through early co-optimization efforts and has expanded its involvement in Intel’s ecosystem by joining both the Intel Foundry Accelerator Design Services Alliance and the new Intel Foundry Chiplet Alliance. These efforts aim to accelerate AI and high-performance computing chip development and foster wider adoption of Intel’s foundry services.

Keysight and Intel Foundry Collaborate on EMIB-T Technology for AI and Data Centers

Keysight Technologies announced a collaboration with Intel Foundry to support the EMIB-T silicon bridge, aimed at advancing high-performance packaging for AI and data center applications. The partnership focuses on enabling compliance with chiplet interconnect standards such as UCIe 2.0 and BoW. Keysight’s Chiplet PHY Designer now supports these standards, offering advanced pre-silicon validation tools to streamline design and reduce development risks. The joint effort enhances interoperability, design flexibility, and system-level performance validation for next-generation semiconductor applications.

Intel’s update shared by CEO Lip-Bu Tan on April 24, 2025:

Intel reported better-than-expected Q1 2025 results, delivering revenue, gross margin, and earnings per share above guidance.

CEO Lip-Bu Tan emphasized that while progress was made, the company faces a volatile macroeconomic environment and must tackle internal inefficiencies. Key initiatives include refocusing Intel as an engineering-driven company, reducing operating expenses and capital spending, flattening organizational structures, streamlining internal processes, and requiring hybrid employees to be on site four days per week starting September 1, 2025.

Workforce reductions will occur in the coming months to improve agility and competitiveness. Tan highlighted that the company must reinvent itself, improve execution, and reestablish Intel’s reputation for innovation.

Intel Reports Flat Q1 2025 Revenue, Launches Cost-Cutting Drive

Santa Clara, CA — Intel posted Q1 2025 revenue of $12.7 billion, flat year-over-year. The company reported a GAAP loss of $0.19 per share, while non-GAAP EPS was $0.13. CEO Lip-Bu Tan announced plans to streamline operations, targeting $17B in 2025 operating expenses, down from $17.5B, and $16B in 2026.

Client Computing revenue dropped 8%, while Data Center and AI grew 8%. Intel forecasts Q2 revenue of $11.2–$12.4B, with expected GAAP EPS of $(0.32) and non-GAAP EPS of $0.00. The company is cutting capital expenditures to $18B and focusing on execution and efficiency as it ramps Intel 18A for late 2025 product launches.

Intel to Sell Majority Stake in Altera Business to Silver Lake Affiliate in $8.75 Billion Deal


Santa Clara, CA — Intel Corporation has entered into a definitive agreement to sell a 51% controlling interest in its Altera business to SLP VII Gryphon Aggregator, L.P., an affiliate of private equity firm Silver Lake. The transaction values Altera at approximately $8.75 billion and is expected to generate roughly $4.4 billion in net cash proceeds for Intel, subject to customary adjustments.

Under the terms of the agreement signed April 14, 2025, Silver Lake will acquire a majority stake in Altera, which will become a standalone entity backed by a newly formed partnership structure. Intel will retain a 49% interest in the business and hold board representation under the new governance structure.

Key Transaction Highlights:

Ownership Structure: Intel and Silver Lake will contribute their shares to a new partnership. Intel will initially hold two board seats and retain consent rights on key matters while owning at least 5%.

Deferred Consideration: Intel is entitled to two $500 million payments in 2026 and 2027, with the first installment potentially accelerating based on market or IPO triggers.

Contingent Consideration: Intel may receive up to $250 million in additional consideration if Silver Lake achieves a 3x return in a future IPO or sale.

Employee Equity Transition: Existing equity awards will be converted into equivalent cash-based long-term incentives provided by the new company.

Separation Agreement: Intel and the new partnership will coordinate a formal separation of Altera’s operations into a standalone structure, with Intel covering up to $277 million in transition costs.

Foundry Supply Commitment: Intel will continue supplying wafers to Altera under an amended Foundry Manufacturing Agreement through 2040. This includes guaranteed inventory and up to $2.25 billion in penalties if Intel prematurely discontinues key 10nm products.

Closing Conditions: The deal is expected to close by August 12, 2025, pending regulatory approvals and customary conditions. The transaction may extend through April 2026 under specific scenarios.

Governance and Oversight: The new limited partnership agreement provides for Intel board representation, minority protections, transfer restrictions, and registration rights. Intel’s consent is required for various structural and strategic decisions while it maintains at least a 5% stake.

Strategic Rationale: The transaction allows Altera to operate with greater strategic flexibility, enhanced capital access, and a focused leadership structure. Intel will continue collaborating with the business under manufacturing and IP-sharing arrangements.

Intel Announces Sale of 51% Stake in Altera to Silver Lake

Intel Corporation has signed a definitive agreement to sell 51% of its Altera business to Silver Lake, valuing the programmable semiconductor unit at $8.75 billion. The deal aims to establish Altera as the largest independent pure-play FPGA company, enhancing its strategic focus on high-growth, AI-driven markets like edge computing and robotics.

Intel will retain a 49% stake in Altera and expects the transaction to close in the second half of 2025. Upon closing, Altera’s financials will be deconsolidated from Intel’s books. In 2024, Altera reported $1.54 billion in revenue and a GAAP operating loss of $615 million, but a non-GAAP operating income of $35 million.

Raghib Hussain, a seasoned semiconductor executive formerly with Marvell and Cavium, will become CEO of Altera effective May 5, 2025, succeeding Sandra Rivera. Silver Lake, a leading technology investment firm, will bring capital and strategic expertise to accelerate Altera's growth.

Intel CEO Lip-Bu Tan noted that the transaction supports Intel’s plan to sharpen focus, reduce expenses, and strengthen the balance sheet, while still participating in Altera’s future upside. Silver Lake described the investment as a rare opportunity to scale a semiconductor leader, and both parties expressed commitment to long-term FPGA leadership.

Intel CEO Lip-Bu Tan to open Intel Foundry Direct Connect 2025

April 3, 2025 – Intel CEO Lip-Bu Tan will headline Intel Foundry Direct Connect 2025 with a keynote address on April 29 at the San Jose McEnery Convention Center. The event will showcase Intel Foundry’s advancements in systems foundry design, process technology, advanced packaging, and testing.

Following Tan’s address, Naga Chandrasekaran, chief technology and operations officer, and Kevin O’Buckley, general manager of Foundry Services, will provide further insights into Intel Foundry’s progress in supporting customers through its global manufacturing capabilities.

Event details:
Date: Tuesday, April 29, 2025
Location: San Jose McEnery Convention Center
Livestream: Begins at 9 a.m. PDT on the Intel Foundry event page, Intel Newsroom, and Intel Foundry YouTube channel
Replay: Available on the event page and Intel Newsroom after the livestream ends

The event will gather customers, partners, and technologists from across the semiconductor ecosystem to explore the future of systems foundry services and innovation.

More information is available at intel.com/foundry.

Intel CEO Lip-Bu Tan to Keynote Intel Vision 2025 in Las Vegas


On March 24, 2025, Intel announced that CEO Lip-Bu Tan will deliver the opening keynote at Intel Vision 2025, a two-day, invitation-only event held in Las Vegas from March 31 to April 1. The event will bring together Intel’s global customers and partners to explore the latest innovations across the compute continuum, particularly within AI, data center, edge, and networking solutions.

The conference will focus on enabling AI-driven business transformation, highlighting Intel's advancements in AI PCs, enterprise security, and scalable infrastructure for AI applications. The keynote will be livestreamed on the Intel Newsroom and YouTube channel on March 31 at 2 p.m. PDT, with a replay available afterward.

Attendees will gain insights into how Intel’s technologies are powering next-generation solutions across industries. To follow updates, visit the [Intel Newsroom](https://www.intel.com/newsroom) or track @IntelNews and @Intel on X and LinkedIn.

Intel Corporation (Nasdaq: INTC) today announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18. He succeeds Interim Co-CEOs David Zinsner and Michelle (MJ) Johnston Holthaus. Tan will also rejoin the Intel board of directors after stepping down from the board in August 2024.

Lip-Bu Tan, the newly appointed CEO of Intel Corporation, addressed employees in a message outlining his vision for the company’s future. Emphasizing Intel’s crucial role in the global technology ecosystem, Tan stressed a renewed focus on engineering excellence, customer satisfaction, and accountability. Acknowledging the company’s recent challenges, he committed to driving Intel’s turnaround through innovation, strategic risk-taking, and teamwork. Tan highlighted the importance of disciplined execution, competitive differentiation, and a strong culture to reestablish Intel as a leader in semiconductor products and foundry services. His leadership philosophy—"Stay humble. Work hard. Delight customers."—will guide Intel’s transformation as it strives to deliver value for customers and shareholders alike.

Intel Corporation announced the appointment of Michelle Johnston Holthaus as Chief Executive Officer of the Intel Products business, effective December 1, 2024. In connection with this appointment, Intel entered into a letter agreement with Ms. Johnston Holthaus on February 28, 2025, detailing her compensation and employment terms.

Under the agreement, her annual base salary increased to $1,000,000, with an annual cash bonus target of 200% of her base salary, amounting to $2,000,000. Additionally, she received an annual long-term incentive equity award with a target value of approximately $16,000,000, as well as a one-time restricted stock unit grant valued at $5,000,000.

Ms. Johnston Holthaus is also eligible for severance benefits under Intel’s Executive Severance Plan. Furthermore, she will be entitled to such benefits if she resigns for good reason within two years following the appointment of a new Chief Executive Officer of Intel, subject to certain conditions.

Intel has launched its Xeon 6 processors, featuring Performance-cores designed to deliver industry-leading performance for data center and network workloads. The new processors provide up to 2x higher AI processing performance and include models optimized for network and edge applications with built-in Intel vRAN Boost, which increases radio access network (RAN) capacity by up to 2.4x.

The Intel Xeon 6700P and 6500P series include more cores, double the memory bandwidth, and AI acceleration in every core. Compared to 5th Generation AMD EPYC processors, Xeon 6 offers up to 1.5x better AI inference performance using one-third fewer cores. Additionally, these processors enable significant power efficiency, allowing for up to 10:1 server consolidation in certain cases, leading to a potential 68% reduction in total cost of ownership.

For network applications, the Xeon 6 SoC integrates built-in accelerators for virtualized RAN, AI, and media processing, making it an optimized solution for AI-driven network expansion. It also introduces the Intel Media Transcode Accelerator, delivering up to 14x performance-per-watt gains.

Intel also introduced new Ethernet controllers and network adapters, including the E830 series for high-bandwidth applications and the E610 series for optimized control plane operations. The Xeon 6 processors are already seeing broad adoption, with over 500 designs in development from companies such as AT&T, Verizon, Cisco, Dell, and Microsoft.

Source: Intel, "Intel Unveils Leadership AI and Networking Solutions with Xeon 6 Processors," February 24, 2025.

Intel Corporation's stock has faced notable fluctuations recently, with the price trading at $19.93 as of January 28, 2025, marking a 1.8% decline from the previous close. This activity comes amidst growing anticipation for the company's fourth-quarter earnings report, which analysts predict will reveal a significant year-over-year revenue drop. Projections suggest revenues of $13.8 billion, down 10%, alongside a net loss of $710 million, compared to last year's $2.66 billion profit. The report will be Intel's first earnings disclosure since the departure of its CEO last month.

Adding to market discussions, former CEO Pat Gelsinger addressed reactions to claims by Chinese startup DeepSeek that its AI model rivals leading competitors with fewer resources. Gelsinger emphasized that such advancements are likely to drive greater demand for computing power, reinforcing the need for semiconductor innovation. These developments, coupled with industry competition and market expectations, continue to shape investor sentiment around Intel's future trajectory.

HSBC upgrades Intel from underperform to hold

Qualcomm hires Intel's Xeon architect to lead development of server CPUs