At the Intel Foundry Direct Connect 2025 event, Intel outlined major developments in its foundry strategy, showcasing advances in process technology, packaging capabilities, manufacturing, and ecosystem partnerships.

Intel confirmed that its Intel 18A node is in risk production, with volume manufacturing expected in 2025. Two new variants—Intel 18A-P and 18A-PT—will provide enhanced performance, with 18A-PT supporting advanced 3D stacking via Foveros Direct. Intel also introduced the 14A process node, with early PDKs distributed and customer engagement underway. On the packaging front, Intel launched new technologies including EMIB-T and two new Foveros variants (R and B), enabling more flexible multi-die designs. The company highlighted a successful “run the lot” milestone at Fab 52 in Arizona and confirmed U.S.-based development and production for Intel 18A and 14A.

Intel also expanded its Foundry Accelerator Alliance with the launch of the Intel Foundry Chiplet Alliance and new ecosystem collaborations with Synopsys, Cadence, Siemens EDA, and PDF Solutions. These moves aim to support design co-optimization, streamline advanced chip development, and broaden adoption of Intel Foundry services.