Global Finance News
16 Mar 2026, 23:38
Corning Incorporated announced it will showcase new optical connectivity technologies designed for artificial intelligence data center networks at the Optical Fiber Communication Conference (OFC) 2026 in Los Angeles.
The company will present several innovations aimed at improving network density, scalability and deployment speed, including a multicore fiber solution capable of delivering up to four times the capacity per fiber strand. Corning will also introduce a high-density micro cable designed for interconnecting AI data centers, next-generation 32-fiber MMC connectors, and expanded-beam PRIZM ferrule connectors that simplify deployment and reduce contamination risks.
In addition, Corning will demonstrate co-packaged optics technology that brings fiber directly to chips, enabling faster data transmission, higher bandwidth density and improved energy efficiency in large AI computing clusters. The new products are part of the company’s GlassWorks AI portfolio of fiber, cable and connectivity solutions aimed at supporting the rapid expansion of AI infrastructure.
Business Wire
The company will present several innovations aimed at improving network density, scalability and deployment speed, including a multicore fiber solution capable of delivering up to four times the capacity per fiber strand. Corning will also introduce a high-density micro cable designed for interconnecting AI data centers, next-generation 32-fiber MMC connectors, and expanded-beam PRIZM ferrule connectors that simplify deployment and reduce contamination risks.
In addition, Corning will demonstrate co-packaged optics technology that brings fiber directly to chips, enabling faster data transmission, higher bandwidth density and improved energy efficiency in large AI computing clusters. The new products are part of the company’s GlassWorks AI portfolio of fiber, cable and connectivity solutions aimed at supporting the rapid expansion of AI infrastructure.
Business Wire