European Investor
10 Mar 2026, 20:16
IBM and Lam Research announced a new five-year collaboration to develop technologies that enable semiconductor logic scaling below the 1-nanometer node. The partnership will focus on advancing novel materials, fabrication processes and High-NA EUV (extreme ultraviolet) lithography techniques required for future generations of semiconductor chips.
The joint work will take place at the NY Creates Albany NanoTech Complex and combine IBM’s semiconductor research capabilities with Lam Research’s wafer fabrication technologies, including advanced etch, deposition and dry resist systems. The goal is to create full manufacturing process flows for next-generation nanosheet and nanostack transistor architectures as well as backside power delivery.
Both companies said the effort aims to enable higher-performance and lower-power chips needed for AI and advanced computing applications, while helping the industry move toward reliable sub-1nm chip production. The collaboration builds on more than a decade of joint work between IBM and Lam Research that previously supported breakthroughs such as nanosheet transistors and IBM’s 2nm chip technology.
Source: PRNewsrie
The joint work will take place at the NY Creates Albany NanoTech Complex and combine IBM’s semiconductor research capabilities with Lam Research’s wafer fabrication technologies, including advanced etch, deposition and dry resist systems. The goal is to create full manufacturing process flows for next-generation nanosheet and nanostack transistor architectures as well as backside power delivery.
Both companies said the effort aims to enable higher-performance and lower-power chips needed for AI and advanced computing applications, while helping the industry move toward reliable sub-1nm chip production. The collaboration builds on more than a decade of joint work between IBM and Lam Research that previously supported breakthroughs such as nanosheet transistors and IBM’s 2nm chip technology.
Source: PRNewsrie