The Investor
06 Oct 2026, 17:13
Applied Materials and Intel Expand Collaboration to Accelerate AI Chip Manufacturing
Applied Materials (NASDAQ: AMAT) and Intel (NASDAQ: INTC) announced an expanded collaboration aimed at accelerating development of next-generation semiconductor technologies for AI computing.
The companies will work together at Applied Materials’ new EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oregon, focusing on advanced transistors, interconnects and packaging technologies. The goal is to shorten development cycles and speed the transition of new semiconductor innovations from research into high-volume manufacturing.
The collaboration includes work on next-generation materials, process technologies and device architectures for advanced logic nodes, as well as interconnect scaling and Foveros-based 3D packaging. These technologies are designed to improve interconnect density, power delivery and thermal performance for high-performance AI systems.
Applied Materials said the partnership builds on decades of cooperation with Intel and is intended to address increasingly complex chipmaking challenges as AI workloads demand greater performance and efficiency.
Intel, meanwhile, said the collaboration will support its foundry ambitions by helping accelerate R&D and manufacturing innovation for advanced AI infrastructure.
Applied’s EPIC Center is expected to become operational in 2026 and is designed to give chipmakers earlier access to new equipment and process technologies, with the aim of bringing semiconductor breakthroughs to market faster.
Applied Materials (NASDAQ: AMAT) and Intel (NASDAQ: INTC) announced an expanded collaboration aimed at accelerating development of next-generation semiconductor technologies for AI computing.
The companies will work together at Applied Materials’ new EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oregon, focusing on advanced transistors, interconnects and packaging technologies. The goal is to shorten development cycles and speed the transition of new semiconductor innovations from research into high-volume manufacturing.
The collaboration includes work on next-generation materials, process technologies and device architectures for advanced logic nodes, as well as interconnect scaling and Foveros-based 3D packaging. These technologies are designed to improve interconnect density, power delivery and thermal performance for high-performance AI systems.
Applied Materials said the partnership builds on decades of cooperation with Intel and is intended to address increasingly complex chipmaking challenges as AI workloads demand greater performance and efficiency.
Intel, meanwhile, said the collaboration will support its foundry ambitions by helping accelerate R&D and manufacturing innovation for advanced AI infrastructure.
Applied’s EPIC Center is expected to become operational in 2026 and is designed to give chipmakers earlier access to new equipment and process technologies, with the aim of bringing semiconductor breakthroughs to market faster.
