The Investor
08 Sep 2026, 16:41
Intel Foundry and ASML Advance High NA EUV for Next-Generation Chip Manufacturing
Intel (NASDAQ: INTC) and ASML are expanding their collaboration to accelerate industry adoption of High Numerical Aperture Extreme Ultraviolet lithography, a key manufacturing technology for increasingly advanced semiconductor designs.
Intel Foundry said High NA EUV is already being used in high-volume manufacturing, with more than one million wafers processed across equipment certification, R&D and production. The technology is being used on select layers of some Intel Core Ultra Series 3 processors, code-named Panther Lake.
Intel also said products manufactured on its Intel 18A process using High NA on selected layers are delivering performance that meets or exceeds comparable layers produced using conventional 0.33 NA EUV systems.
High NA EUV is designed to enable semiconductor manufacturers to print smaller and more complex chip features, making the technology increasingly important as AI and high-performance computing drive demand for more advanced processors.
Intel Foundry and ASML are also working to simplify adoption. Customers can currently use standard 6-inch masks through design optimization or Intel’s reticle-stitching technology, while the companies are collaborating with the broader semiconductor ecosystem on a future transition to larger 6x12-inch masks.
The update strengthens Intel Foundry’s position as an early adopter of High NA EUV. Intel installed ASML’s first commercial High NA system in 2024 and has since moved the technology from testing toward volume production, potentially providing an important manufacturing capability as Intel seeks to expand its foundry business.
Intel (NASDAQ: INTC) and ASML are expanding their collaboration to accelerate industry adoption of High Numerical Aperture Extreme Ultraviolet lithography, a key manufacturing technology for increasingly advanced semiconductor designs.
Intel Foundry said High NA EUV is already being used in high-volume manufacturing, with more than one million wafers processed across equipment certification, R&D and production. The technology is being used on select layers of some Intel Core Ultra Series 3 processors, code-named Panther Lake.
Intel also said products manufactured on its Intel 18A process using High NA on selected layers are delivering performance that meets or exceeds comparable layers produced using conventional 0.33 NA EUV systems.
High NA EUV is designed to enable semiconductor manufacturers to print smaller and more complex chip features, making the technology increasingly important as AI and high-performance computing drive demand for more advanced processors.
Intel Foundry and ASML are also working to simplify adoption. Customers can currently use standard 6-inch masks through design optimization or Intel’s reticle-stitching technology, while the companies are collaborating with the broader semiconductor ecosystem on a future transition to larger 6x12-inch masks.
The update strengthens Intel Foundry’s position as an early adopter of High NA EUV. Intel installed ASML’s first commercial High NA system in 2024 and has since moved the technology from testing toward volume production, potentially providing an important manufacturing capability as Intel seeks to expand its foundry business.
