The Investor
31 Jul 2026, 13:44
Linde to Invest $1.8 Billion in U.S. and Taiwan to Support Semiconductor Expansion
Linde announced plans to invest approximately $1.8 billion to support the expansion of one of the world's largest semiconductor manufacturers across the United States and Taiwan.
The company will invest $1 billion to expand its industrial gas production complex in Phoenix, Arizona, where it will build two new SPECTRA® air separation units to supply ultra-high-purity nitrogen, oxygen and argon to two new semiconductor fabrication plants.
Separately, Linde LienHwa, Linde's joint venture in Taiwan, plans to invest approximately $800 million to build several air separation units and hydrogen production facilities to supply the same customer's new semiconductor manufacturing and advanced packaging sites.
Linde said the investments will strengthen its long-term partnership with the customer while supporting rising global demand for advanced semiconductors. The new facilities are designed to provide the high-purity industrial gases required for next-generation chip manufacturing.
Linde announced plans to invest approximately $1.8 billion to support the expansion of one of the world's largest semiconductor manufacturers across the United States and Taiwan.
The company will invest $1 billion to expand its industrial gas production complex in Phoenix, Arizona, where it will build two new SPECTRA® air separation units to supply ultra-high-purity nitrogen, oxygen and argon to two new semiconductor fabrication plants.
Separately, Linde LienHwa, Linde's joint venture in Taiwan, plans to invest approximately $800 million to build several air separation units and hydrogen production facilities to supply the same customer's new semiconductor manufacturing and advanced packaging sites.
Linde said the investments will strengthen its long-term partnership with the customer while supporting rising global demand for advanced semiconductors. The new facilities are designed to provide the high-purity industrial gases required for next-generation chip manufacturing.
