Synopsys announced an expanded collaboration with TSMC to advance next-generation AI systems through enhanced silicon IP and AI-powered chip design tools. The partnership focuses on optimizing performance, power efficiency, and scalability across advanced semiconductor nodes, including 3nm and 2nm technologies.

The companies highlighted progress in high-speed connectivity solutions, including 224G and 64G interface technologies, as well as advancements in 3D chip design and co-packaged optics for data centers. AI-assisted design tools are also being integrated to improve productivity and accelerate chip development cycles.

The collaboration aims to support growing demand for high-performance computing and AI infrastructure by enabling faster, more efficient semiconductor innovation.

Source: PR Newswire