WS Investor
08 Apr 2026, 22:26
Applied Materials has introduced new deposition systems designed for next-generation “angstrom-era” logic chips, targeting advanced semiconductor manufacturing at 2nm and beyond.
The company unveiled the Precision™ Selective Nitride PECVD system and the Trillium™ ALD system, both engineered to enable atomic-level precision in building Gate-All-Around (GAA) transistors. These technologies allow chipmakers to create smaller, faster, and more energy-efficient transistors critical for AI-driven computing.
The Precision system improves transistor isolation by reinforcing shallow trench structures, reducing energy loss and boosting performance efficiency. Meanwhile, the Trillium system enables highly uniform metal deposition in complex 3D transistor architectures, enhancing reliability and enabling tailored performance for different AI workloads.
Applied Materials said the systems are already being adopted by leading chip manufacturers, reflecting growing demand for advanced materials engineering solutions as traditional chip scaling approaches reach their limits.
Globe Newswire
The company unveiled the Precision™ Selective Nitride PECVD system and the Trillium™ ALD system, both engineered to enable atomic-level precision in building Gate-All-Around (GAA) transistors. These technologies allow chipmakers to create smaller, faster, and more energy-efficient transistors critical for AI-driven computing.
The Precision system improves transistor isolation by reinforcing shallow trench structures, reducing energy loss and boosting performance efficiency. Meanwhile, the Trillium system enables highly uniform metal deposition in complex 3D transistor architectures, enhancing reliability and enabling tailored performance for different AI workloads.
Applied Materials said the systems are already being adopted by leading chip manufacturers, reflecting growing demand for advanced materials engineering solutions as traditional chip scaling approaches reach their limits.
Globe Newswire