Global Finance News
19 Mar 2026, 19:29
Microchip Technology announced the launch of its new BZPACK mSiC power modules, designed for high-performance applications in harsh operating environments.
The modules are built using Microchip’s silicon carbide (SiC) technology and meet stringent HV-H3TRB reliability standards, exceeding 1,000-hour testing requirements. They are intended for use in demanding industrial and renewable energy systems, offering strong thermal performance, insulation, and long-term durability.
Featuring a compact, baseplate-less design with solderless terminals and flexible configurations such as half-bridge and three-phase setups, the BZPACK modules aim to simplify manufacturing and system integration. Microchip stated that the new products help customers build more efficient, reliable power-conversion systems while reducing complexity and time to market.
Globe Newswire
The modules are built using Microchip’s silicon carbide (SiC) technology and meet stringent HV-H3TRB reliability standards, exceeding 1,000-hour testing requirements. They are intended for use in demanding industrial and renewable energy systems, offering strong thermal performance, insulation, and long-term durability.
Featuring a compact, baseplate-less design with solderless terminals and flexible configurations such as half-bridge and three-phase setups, the BZPACK modules aim to simplify manufacturing and system integration. Microchip stated that the new products help customers build more efficient, reliable power-conversion systems while reducing complexity and time to market.
Globe Newswire