European Investor
12 Mar 2026, 19:56
Marvell Technology announced it will showcase a broad portfolio of connectivity technologies designed for AI data center infrastructure at the Optical Fiber Communication Conference (OFC) 2026 in Los Angeles.
The company plans to present more than 20 demonstrations highlighting end-to-end connectivity solutions for next-generation AI data centers, including scale-up, scale-out and scale-across networking architectures. Marvell said connectivity is becoming a major bottleneck as hyperscale AI infrastructure expands, requiring new semiconductor interconnect technologies to support higher bandwidth, lower latency and improved power efficiency.
Technologies on display include 3nm die-to-die connectivity for high-bandwidth memory integration, PCIe 8.0 SerDes running at 256 gigatransfers per second, and Compute Express Link-based near-memory acceleration designed to improve compute and memory scaling. The company will also demonstrate 1.6-terabit optical interconnect technologies, including transmit-retimed optics and optical digital signal processors designed for high-speed AI cluster networking.
Additional solutions include the Photonic Fabric platform for optical scale-up across multi-rack AI systems, Teralynx data center switch silicon for managing high-volume AI traffic, and COLORZ pluggable optics designed to reduce capital costs for data center interconnect networks. Marvell will also showcase its RELIANT telemetry platform, which provides real-time monitoring and analytics across data center connectivity infrastructure.
In total, more than 100 demonstrations across the conference will feature Marvell technology, including over 80 demonstrations by ecosystem partners using Marvell devices and platforms to support AI data center deployments.
Business Wire
The company plans to present more than 20 demonstrations highlighting end-to-end connectivity solutions for next-generation AI data centers, including scale-up, scale-out and scale-across networking architectures. Marvell said connectivity is becoming a major bottleneck as hyperscale AI infrastructure expands, requiring new semiconductor interconnect technologies to support higher bandwidth, lower latency and improved power efficiency.
Technologies on display include 3nm die-to-die connectivity for high-bandwidth memory integration, PCIe 8.0 SerDes running at 256 gigatransfers per second, and Compute Express Link-based near-memory acceleration designed to improve compute and memory scaling. The company will also demonstrate 1.6-terabit optical interconnect technologies, including transmit-retimed optics and optical digital signal processors designed for high-speed AI cluster networking.
Additional solutions include the Photonic Fabric platform for optical scale-up across multi-rack AI systems, Teralynx data center switch silicon for managing high-volume AI traffic, and COLORZ pluggable optics designed to reduce capital costs for data center interconnect networks. Marvell will also showcase its RELIANT telemetry platform, which provides real-time monitoring and analytics across data center connectivity infrastructure.
In total, more than 100 demonstrations across the conference will feature Marvell technology, including over 80 demonstrations by ecosystem partners using Marvell devices and platforms to support AI data center deployments.
Business Wire