European Investor
10 Mar 2026, 23:30
Applied Materials and Micron Technology announced a collaboration to develop next-generation memory technologies for artificial intelligence systems. The partnership will focus on advancing DRAM, high-bandwidth memory (HBM) and NAND storage solutions designed to deliver higher performance and improved energy efficiency for AI workloads.
The joint research will take place at Applied Materials’ new EPIC Center in Silicon Valley and Micron’s innovation facilities in Boise, Idaho. Engineers from both companies will work together on new materials, semiconductor manufacturing processes, device architectures and advanced packaging technologies to accelerate the development and commercialization of future memory chips.
The companies said the collaboration aims to strengthen the U.S. semiconductor innovation pipeline and shorten the time from early research to high-volume manufacturing. The EPIC Center, which represents a planned investment of up to $5 billion, is intended to help chipmakers rapidly move new technologies from laboratory development to production.
Globe Newswire
The joint research will take place at Applied Materials’ new EPIC Center in Silicon Valley and Micron’s innovation facilities in Boise, Idaho. Engineers from both companies will work together on new materials, semiconductor manufacturing processes, device architectures and advanced packaging technologies to accelerate the development and commercialization of future memory chips.
The companies said the collaboration aims to strengthen the U.S. semiconductor innovation pipeline and shorten the time from early research to high-volume manufacturing. The EPIC Center, which represents a planned investment of up to $5 billion, is intended to help chipmakers rapidly move new technologies from laboratory development to production.
Globe Newswire