Lam Research and CEA-Leti announced a new multi-year research and development agreement aimed at advancing the fabrication of next-generation specialty semiconductor technologies. The collaboration will focus on developing new materials and fabrication processes for more energy-efficient and higher-performance devices used in areas such as MEMS, 3D imaging and sensors, RF and power management, photonics including MicroLED displays, and optical interconnects.

Under the agreement, the partners will explore novel multi-elemental materials and compound semiconductors, combining Lam Research’s etch and deposition technologies with CEA-Leti’s expertise in materials analysis and device characterization. The goal is to accelerate pathfinding and overcome key integration challenges for specialty technologies that support AI, high-performance computing, quantum optics, and advanced RF applications.

Source: PRNewswire