Synopsys (NASDAQ: SNPS) announced an expanded collaboration with TSMC to enable advanced 2D and 3D chip design solutions, targeting applications in AI, high-speed data communications, and advanced computing. The partnership integrates Ansys simulation and analysis tools into TSMC’s latest process technologies, including N3C, N3P, N2P, and A16, with certified workflows for power, thermal, and electromagnetic integrity.

The companies also introduced an AI-assisted optimization flow for TSMC’s COUPE photonic platform, aimed at shortening design cycles and improving quality for optical and photonic systems. By combining Synopsys’ 3DIC design tools with Ansys multiphysics platforms, the collaboration supports larger, more complex designs and enhances resilience against electrical stress, enabling chipmakers to accelerate development of energy-efficient, high-performance semiconductors for next-generation technologies.