Lam Research and JSR Corporation (including its subsidiary Inpria) announced a cross-licensing and collaboration agreement to accelerate next-generation semiconductor manufacturing. The partnership focuses on advanced patterning technologies such as dry resist EUV lithography, high-NA EUV resists, and new materials for atomic layer etching and deposition. Lam will combine its expertise in deposition, etch, and its Aether® dry resist platform with JSR/Inpria’s leading metal oxide photoresist technologies.

The agreement also resolves all ongoing litigation between the companies, including Inpria v. Lam Research in Delaware. Both firms said the collaboration will help chipmakers scale efficiently for artificial intelligence and high-performance computing demands by lowering the cost and complexity of producing advanced chips.